# Heat conduction

### From Thermal-FluidsPedia

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:[[Lumped analysis]], [[one-dimensional transient heat conduction in finite slab|finite slabs]], [[One-dimensional transient heat conduction in cylinder|cylinders]], [[One-dimensional transient heat conduction in sphere|spheres]], [[One-dimensional transient heat conduction in semi-infinite body|semi-infinite body]], and [[Multidimensional transient heat conduction|multidimensional conduction]]. | :[[Lumped analysis]], [[one-dimensional transient heat conduction in finite slab|finite slabs]], [[One-dimensional transient heat conduction in cylinder|cylinders]], [[One-dimensional transient heat conduction in sphere|spheres]], [[One-dimensional transient heat conduction in semi-infinite body|semi-infinite body]], and [[Multidimensional transient heat conduction|multidimensional conduction]]. | ||

- | *<B>Numerical Solution of Heat Conduction</b> | + | *<B>[[Numerical Solution of Heat Conduction]]</b> |

- | :[[Discretization]] of computational domain and governing equations, one-dimensional [[steady]] and [[unsteady]] state conduction, [[multi-dimensional unsteady-state conduction]], and [[solution of algebraic equations]] | + | :[[Discretization]] of computational domain and governing equations, one-dimensional [[Numerical Solution of 1-D Steady Conduction|steady]] and [[Numerical Solution of 1-D Unsteady Conduction|unsteady]] state conduction, [[numerical solution of multi-dimensional unsteady-state conduction|multi-dimensional unsteady-state conduction]], and [[solution of algebraic equations]] |

*<b>[[Melting and Solidification|Melting and Solidification]]</b> | *<b>[[Melting and Solidification|Melting and Solidification]]</b> | ||

- | :[[Classification of Melting and Solidification|Classifications]], [[Boundary Conditions at Solid-Liquid Interface|boundary conditions at interface]],[[Exact Solutions of Melting and Solidification Problems|exact solutions]], [[Integral Approximate Solution of Melting and Solidification Problems|integral approximate solution]], [[Numerical Simulation of Melting and Solidification|numerical solution]], [[Solidification of a | + | :[[Classification of Melting and Solidification|Classifications]], [[Boundary Conditions at Solid-Liquid Interface|boundary conditions at interface]],[[Exact Solutions of Melting and Solidification Problems|exact solutions]], [[Integral Approximate Solution of Melting and Solidification Problems|integral approximate solution]], [[Numerical Simulation of Melting and Solidification|numerical solution]], [[Solidification of a binary solution system|binary system]], and [[Melting and Solidification in Porous Media|melting and solidification in porous media]]. |

*<b>[[Microscale heat conduction|Microscale Heat Conduction]]</b> | *<b>[[Microscale heat conduction|Microscale Heat Conduction]]</b> | ||

- | :[[Hyperbolic model]], [[Dual-Phase Lag (DPL) model]], | + | :[[Hyperbolic model]], [[Dual-Phase Lag (DPL) model]], [[two-temperature models]], and [[ultrafast melting and solidification]]. |

*<b>[[Related topics in heat conduction|Related Topics]]</b> | *<b>[[Related topics in heat conduction|Related Topics]]</b> | ||

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Back to [[Heat and Mass Transfer]].<br> | Back to [[Heat and Mass Transfer]].<br> | ||

- | Back to [[Main Page| | + | Back to [[Main Page|'''T'''hermal-'''F'''luids'''P'''edia Main Page]]. |

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+ | ==References== | ||

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+ | Faghri, A., Zhang, Y., and Howell, J. R., 2010, ''Advanced Heat and Mass Transfer'', Global Digital Press, Columbia, MO. | ||

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+ | ==Further Reading== | ||

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+ | ==External Links== |

## Current revision as of 13:59, 5 August 2010

Conduction is heat transfer across a stationary medium, either solid or fluid. For an electrically nonconducting solid, conduction is attributed to atomic activity in the form of lattice vibration, while the mechanism of conduction in an electrically-conducting solid is a combination of lattice vibration and translational motion of electrons. Heat conduction in a liquid or gas is due to the random motion and interaction of the molecules. For most engineering problems, it is impractical and unnecessary to track the motion of individual molecules and electrons, which may instead be described using the macroscopic averaged temperature.

- One-dimensional heat conduction, plane and radial walls, extended surface, bioheat equation, two-dimensional heat conduction, and conduction from buried object.

- Lumped analysis, finite slabs, cylinders, spheres, semi-infinite body, and multidimensional conduction.

- Discretization of computational domain and governing equations, one-dimensional steady and unsteady state conduction, multi-dimensional unsteady-state conduction, and solution of algebraic equations

- Classifications, boundary conditions at interface,exact solutions, integral approximate solution, numerical solution, binary system, and melting and solidification in porous media.

- Hyperbolic model, Dual-Phase Lag (DPL) model, two-temperature models, and ultrafast melting and solidification.

Back to Heat and Mass Transfer.

Back to **T**hermal-**F**luids**P**edia Main Page.

## References

Faghri, A., Zhang, Y., and Howell, J. R., 2010, *Advanced Heat and Mass Transfer*, Global Digital Press, Columbia, MO.